Date of Award
1-1-2013
Language
English
Document Type
Dissertation
Degree Name
Doctor of Philosophy (PhD)
College/School/Department
Department of Nanoscale Science and Engineering
Program
Nanoscale Engineering
Content Description
1 online resource (xv, 120 pages) : illustrations (some color)
Dissertation/Thesis Chair
Kathleen Dunn
Committee Members
Jobert van Eisden, Vincent LaBella, James Lloyd, Christian Witt
Keywords
copper, damascene, electrochemical deposition, polyethylene glycol, suppressor, tri-block copolymer, Interconnects (Integrated circuit technology), Polyethylene glycol, Polypropylene, Electroplating
Subject Categories
Chemical Engineering | Electrical and Electronics | Nanoscience and Nanotechnology
Abstract
A laboratory scale plating cell was built that provided reproducible bottom-up fill results for the electrochemical deposition of copper in damascene features. Several techniques used in the full wafer plating tool were incorporated into the setup to accurately control the process conditions. These techniques included but were not limited to a voltage controlled `hot-entry' step, a custom coupon holder to allow sample rotation, a secondary thief electrode and an automatic entry system. The results of qualification experiments are presented to demonstrate that precise control was realized along with repeatable partial fill plating results. The qualified setup was then used to perform time-evolved partial fill plating experiments using several different structural configurations of open-source suppressors to investigate their affect on the gap-fill characteristics.
Recommended Citation
Ryan, Kevin, "Properties of PEG, PPG and their copolymers influence on the gap-fill characteristics of damascene interconnects" (2013). Legacy Theses & Dissertations (2009 - 2024). 999.
https://scholarsarchive.library.albany.edu/legacy-etd/999
Included in
Chemical Engineering Commons, Electrical and Electronics Commons, Nanoscience and Nanotechnology Commons