Date of Award
1-1-2011
Language
English
Document Type
Dissertation
Degree Name
Doctor of Philosophy (PhD)
College/School/Department
Department of Nanoscale Science and Engineering
Program
Nanoscale Engineering
Content Description
1 online resource (xiii, 159 pages) : illustrations (some color)
Dissertation/Thesis Chair
Robert E Geer
Committee Members
Alain C Diebold, Christopher L Borst, Bin Yu, Donald F Canaperi
Keywords
CMP, Copper, glycine, Nanoabrasives, planarization, Slurries, Chemical mechanical planarization, Slurry, Abrasives
Subject Categories
Materials Science and Engineering | Nanoscience and Nanotechnology
Abstract
Chemical mechanical planarization (CMP) is an enabling process technology for IC fabrication to maintain global planarity across the wafer to satisfy lithographic depth of focus constraints. It also enables integration of materials that cannot be anisotropically etched, such as Cu. CMP utilizes nanoparticle abrasives in aqueous slurry to aid in planarization.
Recommended Citation
Manikonda, Shravanthi Lakshmi, "Investigation of novel alumina nanoabrasive and the interactions with basic chemical components in copper chemical mechanical planarization (CMP) slurries" (2011). Legacy Theses & Dissertations (2009 - 2024). 396.
https://scholarsarchive.library.albany.edu/legacy-etd/396