Date of Award
1-1-2017
Language
English
Document Type
Dissertation
Degree Name
Doctor of Philosophy (PhD)
College/School/Department
Department of Nanoscale Science and Engineering
Program
Nanoscale Engineering
Content Description
1 online resource (ii, xx, 155 pages) : illustrations (some color)
Dissertation/Thesis Chair
James R Lloyd
Committee Members
Hassaram Bakhru, Christopher Borst, Ernest N Levine, Bhaskar Nagabhirava
Keywords
Electromigration, Microstructure, Modeling, Reliability, Simulation, Young’s Modulus, Interconnects (Integrated circuit technology), Copper, Anisotropy, Nanostructured materials
Subject Categories
Materials Science and Engineering | Nanoscience and Nanotechnology
Abstract
Copper interconnects are typically polycrystalline and follow a lognormal grain size distribution. Polycrystalline copper interconnect microstructures with a lognormal grain size distribution were obtained with a Voronoi tessellation approach. The interconnect structures thus obtained were used to study grain growth mechanisms, grain boundary scattering, scattering dependent resistance of interconnects, stress evolution, vacancy migration, reliability life times, impact of orientation dependent anisotropy on various mechanisms, etc. In this work, the microstructures were used to study the impact of microstructure and elastic anisotropy of copper on thermal and electromigration induced failure.
Recommended Citation
Basavalingappa, Adarsh, "Modeling and studying the effect of texture and elastic anisotropy of copper microstructure in nanoscale interconnects on reliability in integrated circuits" (2017). Legacy Theses & Dissertations (2009 - 2024). 1781.
https://scholarsarchive.library.albany.edu/legacy-etd/1781