Date of Award

1-1-2016

Language

English

Document Type

Master's Thesis

Degree Name

Master of Science (MS)

College/School/Department

Department of Nanoscale Science and Engineering

Program

Nanoscale Engineering

Content Description

1 online resource (iii, 74 pages) : illustrations (some color)

Dissertation/Thesis Chair

Kathleen A Dunn

Committee Members

James Lloyd, Ernest Levine, Steven Novak, Sean Branagan

Keywords

copper, damascene, manganese, microstructure, seed, texture, Physical vapor deposition, Nanostructured materials, Transmission electron microscopy, Manganese-copper alloys, Interconnects (Integrated circuit technology), Integrated circuits

Subject Categories

Materials Science and Engineering | Nanoscience and Nanotechnology

Abstract

This thesis describes the grain texture and microstructure of Ionized Physical Vapor Deposition (iPVD) Copper Manganese seed in 1 µm and 70 nm wide damascene trenches. Using Transmission Electron Microscopy (TEM) imaging and diffraction pattern analysis, the grain size and general orientation of the grains were determined. It was found that the 1 µm wide trenches contained larger grains and more texture than that of the 70 nm wide trenches. While this thesis builds upon previous work by Brendan O’Brien in the Dunn group, one significantly different finding will be presented regarding the structure on the sidewall of the trenches. This difference will be discussed in light of the role of Manganese in the seed layer and suggests a possible alternate explanation for rapid recrystallization of subsequently electroplated copper used for wiring in integrated circuits.

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