Date of Award

1-1-2015

Language

English

Document Type

Dissertation

Degree Name

Doctor of Philosophy (PhD)

College/School/Department

Department of Nanoscale Science and Engineering

Program

Nanoscale Engineering

Content Description

1 online resource (xii, 104 pages) : color illustrations

Dissertation/Thesis Chair

Kathleen A Dunn

Committee Members

James Lloyd, Steven Novak, Katayun Barmak, Conal Murray

Keywords

Alloys, Back End-of-the-Line, Copper, Electrochemical Deposition, Recrystallization, Transmission Electron Microscopy, Copper plating, Copper alloys, Thin films, Interconnects (Integrated circuit technology), Nanostructured materials

Subject Categories

Materials Science and Engineering | Nanoscience and Nanotechnology

Abstract

Despite the significant improvements originally offered by the use of Cu over Al as the interconnect material for semiconductor devices, the continued down-scaling of interconnects has presented significant challenges for semiconductor engineers. As the metal line widths shrink, both the conductivity and reliability of lines decrease due to a stubbornly fine-grained microstructure in narrow lines.

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