Date of Award
1-1-2015
Language
English
Document Type
Dissertation
Degree Name
Doctor of Philosophy (PhD)
College/School/Department
Department of Nanoscale Science and Engineering
Program
Nanoscale Engineering
Content Description
1 online resource (xi, 183 pages) : color illustrations
Dissertation/Thesis Chair
Fatemeh Shahedipour-Sandvik
Committee Members
Alain Diebold, Hassaram Bakhru, Kenneth Jones, Andrew Clark
Keywords
Gallium nitride, Nitrides, Epitaxy, Strains and stresses, Semiconductor films, Semiconductors, Silicon-on-insulator technology
Subject Categories
Materials Science and Engineering | Nanoscience and Nanotechnology
Abstract
III-Nitrides have been a heavily researched material system for decades. Their material properties are favorable for a number of applications, most commonly in the optoelectronic and power device industry. Currently a majority of commercialized devices are fabricated on sapphire and SiC substrates but these are expensive and limit the widespread commercialization of the technology. There is substantial ongoing research geared toward the development of GaN on Si substrates because of the significant cost saving that would be realized through the inexpensive, large wafer and maturity of Si fabrication. Significant challenges with the deposition of GaN on Si have, thus far, prevented its wide-spread commercialization specifically the large lattice mismatch and thermal expansion coefficient mismatch. Both of these issues can be overcome by engineering the stress levels in the films. In this thesis work close examination and exploration of the stress formation and evolution in GaN-on-Si is performed. Methods of improving stress levels are developed in addition to providing a deeper understanding of the stress evolution process.
Recommended Citation
Leathersich, Jeff, "Design and development of stress engineering techniques for III-Nitride epitaxy on Si" (2015). Legacy Theses & Dissertations (2009 - 2024). 1434.
https://scholarsarchive.library.albany.edu/legacy-etd/1434