Date of Award

1-1-2015

Language

English

Document Type

Dissertation

Degree Name

Doctor of Philosophy (PhD)

College/School/Department

Department of Nanoscale Science and Engineering

Program

Nanoscale Engineering

Content Description

1 online resource (ix, 131 pages) : color illustrations.

Dissertation/Thesis Chair

Michael Liehr

Committee Members

Douglas Coolbaugh, Robert Geer, Alain Diebold, John Burke

Keywords

Three-dimensional integrated circuits, Microelectronic packaging

Subject Categories

Electrical and Electronics | Electromagnetics and Photonics

Abstract

3D integration using through-silicon-vias (TSVs) is gaining considerable attention due to its superior packaging efficiency resulting in higher functionality, improved performance and a reduction in power consumption. In order to implement 3D chip designs with TSV technology, robust TSV electrical models are required. Specifically, due to the increase of signal speeds into the gigahertz (GHz) spectrum, a high frequency electrical characterization best describes TSV behavior.

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