Date of Award

1-1-2013

Language

English

Document Type

Dissertation

Degree Name

Doctor of Philosophy (PhD)

College/School/Department

Department of Nanoscale Science and Engineering

Program

Nanoscale Engineering

Content Description

1 online resource (xv, 120 pages) : illustrations (some color)

Dissertation/Thesis Chair

Kathleen Dunn

Committee Members

Jobert van Eisden, Vincent LaBella, James Lloyd, Christian Witt

Keywords

copper, damascene, electrochemical deposition, polyethylene glycol, suppressor, tri-block copolymer, Interconnects (Integrated circuit technology), Polyethylene glycol, Polypropylene, Electroplating

Subject Categories

Chemical Engineering | Electrical and Electronics | Nanoscience and Nanotechnology

Abstract

A laboratory scale plating cell was built that provided reproducible bottom-up fill results for the electrochemical deposition of copper in damascene features. Several techniques used in the full wafer plating tool were incorporated into the setup to accurately control the process conditions. These techniques included but were not limited to a voltage controlled `hot-entry' step, a custom coupon holder to allow sample rotation, a secondary thief electrode and an automatic entry system. The results of qualification experiments are presented to demonstrate that precise control was realized along with repeatable partial fill plating results. The qualified setup was then used to perform time-evolved partial fill plating experiments using several different structural configurations of open-source suppressors to investigate their affect on the gap-fill characteristics.

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