Date of Award

1-1-2015

Language

English

Document Type

Dissertation

Degree Name

Doctor of Philosophy (PhD)

College/School/Department

Department of Nanoscale Science and Engineering

Program

Nanoscale Sciences

Content Description

1 online resource (xxi, 146 pages) : color illustrations.

Dissertation/Thesis Chair

Robert E Geer

Committee Members

Michael Liehr, Douglas D Coolbaugh, James Castracane, Pavel Kabos

Keywords

3D IC, High frequency, signal integrity, Through Silicon Via, Three-dimensional integrated circuits, Microelectronic packaging, Signal processing

Subject Categories

Electrical and Electronics | Materials Science and Engineering | Nanoscience and Nanotechnology

Abstract

Through silicon vias (TSVs) enable 3-dimensional (3D) integrated circuits (ICs), which have the potential to reduce the power consumption, interconnect length and overall communication latency in modern nanoelectronics systems. High-speed signal transmission channels through stacked silicon substrates are critical for 3D heterogeneous integration. This work presents systematic analyses of fabricated 3D IC test structures. This includes test structure design, fabrication, experimental characterization, equivalent circuit modeling and full wave simulations for high-speed signal transmission of the TSV based 3D IC channels.

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