Date of Award
Bachelor of Science
To study grain boundary solute interactions we have developed recipes for co-electrodeposition of dilute copper alloys including Cu(Ni) and Cu(Co). Secondary Ion Mass Spectrometry (SIMS) was used to analyze the incorporation of solute into the copper film. In addition to the co-electrodeposition process we also used a drive-in diffusion model for Au, Ag, Co, and Ni. Atomic imaging in a scanning transmission electron microscope (STEM) was used to visualize and investigate solute at grain boundaries and interfaces in polygranular copper films. By understanding these interactions and pathways of alloying solutes in copper microstructures, we can more accurately predict alloying behavior and how they inhibit or promote grain boundary diffusion. Understanding how these alloys interact with grain boundary diffusion pathways and interfaces will, in turn, enable grain boundary and interface engineering solutions to obstacles faced by semiconductor manufacturers as more aggressive feature sizes are pursued.
Prestowitz, Luke, "Alloy Solute Interactions at Grain Boundaries and Nanoscale Interfaces in Copper" (2015). Nanoscale Science & Engineering. 8.